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Peripheral Integrated Circuits
Notes:
1.
Power dissipation rating for TDFN6 package in free air is 320°C/Watt. Soldering the package to a PCB, including the die
attach paddle, improves temperature performance substantially. The input voltage and output current are limited by thermal
power dissipation at the package.
2.
Due to package size, TDFN6 package has a three-letter code to designate part type.
Package:
Please see the package drawing section in the Appendix for dimensions of the TDFN6 package.
Pin Configuration
Vreg (Out)
No Connect
No Connect
DC001-10,
DC002-10
Ground
VCC (In)
No Connect
Note: The die attach pad is exposed on the back of this package. NVE recommends that it be connected to
the ground pin and the PCB for improved temperature performance.
- 69 -
www.nve.com phone: 952-829-9217 fax: 952-829-9189
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